Our Services

MAW HI END CO., LTD. specializes in custom semiconductor packaging for R&D prototypes, low-volume production, special substrates, and non-standard structures. Each inquiry is evaluated individually based on the die, substrate, materials, process requirements, and quantity.

Packaging Capabilities

• Chip-on-Board (COB) and custom bare-die packaging
• Die attach
• Gold and aluminum wire bonding
• Encapsulation and related packaging processes
• R&D prototyping and low-volume production
• Integration of substrate, PCB, and related assembly requirements
• Special structures evaluated on a project basis

Equipment Improvement

In addition to packaging services, we undertake semiconductor equipment and mechanical improvement projects. Feasibility is evaluated based on the existing equipment, process requirements, and intended use before a project-specific improvement plan is proposed.

Project Process

Materials, process conditions, inspection scope, lead time, and other technical requirements are confirmed for each project after an initial review. Our standard inspection is microscopic visual inspection. Dedicated fixtures and electrical testing, when required, are evaluated separately.

Confidentiality

This page presents only representative projects from earlier years or projects approved for public release. Most recent work is protected by non-disclosure agreements (NDAs) and customer confidentiality requirements. We therefore do not disclose customer names, die layouts, drawings, process conditions, or product photographs. Detailed technical capabilities and project arrangements can be discussed after the requirements are reviewed and any necessary confidentiality procedures are completed.

Experience

We have provided custom semiconductor packaging services to U.S. university research teams and industrial customers in Japan and Taiwan. We have also supported semiconductor equipment and mechanical improvement projects for major manufacturers.

Contact Us

For international inquiries, please contact us primarily by email and provide a brief project overview, estimated quantity, and target schedule. Detailed technical documents and confidential information may be reviewed after an NDA is in place, when necessary.

Email: mawformosa@gmail.com
Phone: +886 4 2339 6655

Selected Historical Packaging Projects

The images below show selected packaging and prototype projects from earlier years that may be publicly presented. They illustrate our experience with different structures and processes and do not represent current customer projects.

01｜Multi-Unit Array Packaging
02｜Module with 128 Aluminum Wire Bonds
03｜Protective Frame Structure
04｜RFID Lead-Frame Package with Gold Wire Bonding
05｜Fingerprint Sensor Module
06｜Low-Profile Module for Height-Constrained Applications