MAW PRECISION SEMICONDUCTOR PACKAGING

Custom Support for R&D, Prototyping and Low-Volume Production

Founded in Taiwan in 1997, MAW provides project-based semiconductor packaging and semiconductor equipment improvement services for universities, research organizations, product-development teams and industrial clients. We have supported projects in the United States, Japan and Taiwan.

SERVICES

• Chip-on-Board (COB) and custom bare-die packaging

• Die attach

• Gold and aluminum wire bonding

• Encapsulation and related packaging

• Prototype and low-volume production support

• Coordination of substrate, PCB and assembly requirements

• Semiconductor equipment and mechanical improvement

Technical conditions, materials, inspection and lead time are confirmed individually after we review each inquiry.

CONFIDENTIALITY

Most current projects are covered by non-disclosure agreements (NDAs). This website therefore shows only materials authorized for release and selected historical references. Customer identities, product information, drawings and process conditions are not disclosed.

PROJECT EXPERIENCE

Our experience includes custom packaging for U.S. university research teams and industrial clients in Japan and Taiwan, as well as semiconductor equipment and mechanical improvement projects for major manufacturers.

MAW AUDIO HERITAGE

MAW Audio is part of our technical history since the company was founded. Earlier products, reviews and exhibition archives remain available on this website, and audio-related inquiries are still welcome.

CONTACT

For international inquiries, please contact us primarily by email. Send a brief project overview, anticipated quantity and target schedule. Detailed technical information and confidential materials can be reviewed under an NDA when appropriate.

MAW HI END CO., LTD.

Taichung, Taiwan

Email: mawformosa@gmail.com